JESD-30 CODE:  R-PDSO-G8

JESD-609 CODE:  E3

LENGTH:  4.9 MM

MANUFACTURER:  RAMTRON INTERNATIONAL CORPORATION

MANUFACTURER PART NUMBER:  FM25CL64-G

MEMORY DENSITY:  65.536 KBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  8

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  8.192 K

NUMBER OF WORDS CODE:  8000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  8KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP8,.25

PACKAGE EQUIVALENCE CODE:  SOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  8

POWER SUPPLIES:  3/3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.75 MM

STANDBY CURRENT-MAX:  1 ΜA

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  10 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.65 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN (SN) - ANNEALED

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  3.9 MM