HD6473887H
FQFP, QFP100,.63SQ,20Call for availability
Mfr Part#: HD6473887H
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: FQFP
PACKAGE DESCRIPTION: FQFP, QFP100,.63SQ,20
PACKAGE EQUIVALENCE CODE: QFP100,.63SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, FINE PITCH
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO OPERATES AT 1.8V MINIMUM SUPPLY
ADDRESS BUS WIDTH: 0
BIT SIZE: 8
CPU FAMILY: H8/300L
CLOCK FREQUENCY-MAX: 6 MHZ
DAC CHANNELS: NO
DMA CHANNELS: NO
EXTERNAL DATA BUS WIDTH: 0
HAS ADC: YES
JESD-30 CODE: S-PQFP-G100
JESD-609 CODE: E0
LENGTH: 14 MM
MANUFACTURER: RENESAS ELECTRONICS CORPORATION
MANUFACTURER PART NUMBER: HD6473887H
NUMBER OF I/O LINES: 84
NUMBER OF TERMINALS: 100
OPERATING TEMPERATURE-MAX: 75 °C
OPERATING TEMPERATURE-MIN: -20 °C
PWM CHANNELS: YES
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: FQFP
PACKAGE DESCRIPTION: FQFP, QFP100,.63SQ,20
PACKAGE EQUIVALENCE CODE: QFP100,.63SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, FINE PITCH
PART PACKAGE CODE: QFP
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 100
POWER SUPPLIES: 2/5 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 2048
ROM (WORDS): 61440
ROM PROGRAMMABILITY: OTPROM
SEATED HEIGHT-MAX: 3.05 MM
SPEED: 3 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY CURRENT-MAX: 1 MA
SUPPLY VOLTAGE-MAX: 5.5 V
SUPPLY VOLTAGE-MIN: 4.5 V
SUPPLY VOLTAGE-NOM: 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL EXTENDED
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 14 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROCONTROLLER
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