HD6473887H

HD6473887H

FQFP, QFP100,.63SQ,20

Call for availability

Manufactured by:

RENESAS

Mfr Part#:  HD6473887H

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FQFP

PACKAGE DESCRIPTION:  FQFP, QFP100,.63SQ,20

PACKAGE EQUIVALENCE CODE:  QFP100,.63SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  ALSO OPERATES AT 1.8V MINIMUM SUPPLY

ADDRESS BUS WIDTH:  0

BIT SIZE:  8

CPU FAMILY:  H8/300L

CLOCK FREQUENCY-MAX:  6 MHZ

DAC CHANNELS:  NO

DMA CHANNELS:  NO

EXTERNAL DATA BUS WIDTH:  0

HAS ADC:  YES

JESD-30 CODE:  S-PQFP-G100

JESD-609 CODE:  E0

LENGTH:  14 MM

MANUFACTURER:  RENESAS ELECTRONICS CORPORATION

MANUFACTURER PART NUMBER:  HD6473887H

NUMBER OF I/O LINES:  84

NUMBER OF TERMINALS:  100

OPERATING TEMPERATURE-MAX:  75 °C

OPERATING TEMPERATURE-MIN:  -20 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FQFP

PACKAGE DESCRIPTION:  FQFP, QFP100,.63SQ,20

PACKAGE EQUIVALENCE CODE:  QFP100,.63SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, FINE PITCH

PART PACKAGE CODE:  QFP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  100

POWER SUPPLIES:  2/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  2048

ROM (WORDS):  61440

ROM PROGRAMMABILITY:  OTPROM

SEATED HEIGHT-MAX:  3.05 MM

SPEED:  3 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  1 MA

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL EXTENDED

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER

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