HD74LS76AP

HD74LS76AP

6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-16

Call for availability

Manufactured by:

RENESAS

Mfr Part#:  HD74LS76AP

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-16

PACKAGE EQUIVALENCE CODE:  DIP16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

FAMILY:  LS

JESD-30 CODE:  R-PDIP-T16

JESD-609 CODE:  E0

LENGTH:  19.2 MM

LOAD CAPACITANCE (CL):  15 PF

LOGIC IC TYPE:  J-K FLIP-FLOP

MANUFACTURER:  RENESAS ELECTRONICS CORPORATION

MANUFACTURER PART NUMBER:  HD74LS76AP

MAX I(OL):  8 MA

NUMBER OF BITS:  2

NUMBER OF FUNCTIONS:  2

NUMBER OF TERMINALS:  16

OPERATING TEMPERATURE-MAX:  75 °C

OPERATING TEMPERATURE-MIN:  -20 °C

OUTPUT POLARITY:  COMPLEMENTARY

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-16

PACKAGE EQUIVALENCE CODE:  DIP16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  16

POWER SUPPLIES:  5 V

POWER SUPPLY CURRENT-MAX (ICC):  6 MA

PROP. DELAY@NOM-SUP:  20 NS

PROPAGATION DELAY (TPD):  20 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.06 MM

SUBCATEGORY:  FF/LATCHES

SUPPLY VOLTAGE-MAX (VSUP):  5.25 V

SUPPLY VOLTAGE-MIN (VSUP):  4.75 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  TTL

TEMPERATURE GRADE:  COMMERCIAL EXTENDED

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

TRIGGER TYPE:  NEGATIVE EDGE

WIDTH:  7.62 MM

FMAX-MIN:  30 MHZ

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