HN27C4096AG-12

HN27C4096AG-12

WDIP

Call for availability

Manufactured by:

RENESAS

Mfr Part#:  HN27C4096AG-12

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  WDIP

PACKAGE DESCRIPTION:  WDIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE, WINDOW

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  120 NS

JESD-30 CODE:  R-GDIP-T40

LENGTH:  52.07 MM

MANUFACTURER:  RENESAS ELECTRONICS CORPORATION

MANUFACTURER PART NUMBER:  HN27C4096AG-12

MEMORY DENSITY:  4.1943 MBIT

MEMORY IC TYPE:  UVPROM

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  40

NUMBER OF WORDS:  262.144 K

NUMBER OF WORDS CODE:  256000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  256KX16

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  WDIP

PACKAGE DESCRIPTION:  WDIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE, WINDOW

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PIN COUNT:  40

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  6.3 MM

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

WIDTH:  15.24 MM

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