M30245FCGP
LFQFP, QFP100,.63SQ,20Call for availability
Mfr Part#: M30245FCGP
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP100,.63SQ,20
PACKAGE EQUIVALENCE CODE: QFP100,.63SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDRESS BUS WIDTH: 20
BIT SIZE: 16
CPU FAMILY: M16C
CLOCK FREQUENCY-MAX: 16 MHZ
DAC CHANNELS: NO
DMA CHANNELS: YES
EXTERNAL DATA BUS WIDTH: 16
HAS ADC: YES
JESD-30 CODE: S-PQFP-G100
JESD-609 CODE: E2
LENGTH: 14 MM
MANUFACTURER: RENESAS ELECTRONICS CORPORATION
MANUFACTURER PART NUMBER: M30245FCGP
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF I/O LINES: 83
NUMBER OF TERMINALS: 100
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -20 °C
PWM CHANNELS: YES
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP100,.63SQ,20
PACKAGE EQUIVALENCE CODE: QFP100,.63SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: QFP
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 100
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 10240
ROM (WORDS): 131072
ROM PROGRAMMABILITY: FLASH
SEATED HEIGHT-MAX: 1.7 MM
SPEED: 16 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY CURRENT-MAX: 43 MA
SUPPLY VOLTAGE-MAX: 3.6 V
SUPPLY VOLTAGE-MIN: 3 V
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: OTHER
TERMINAL FINISH: TIN COPPER
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 20
WIDTH: 14 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROCONTROLLER
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