M30245FCGP

M30245FCGP

LFQFP, QFP100,.63SQ,20

Call for availability

Manufactured by:

RENESAS

Mfr Part#:  M30245FCGP

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP100,.63SQ,20

PACKAGE EQUIVALENCE CODE:  QFP100,.63SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  20

BIT SIZE:  16

CPU FAMILY:  M16C

CLOCK FREQUENCY-MAX:  16 MHZ

DAC CHANNELS:  NO

DMA CHANNELS:  YES

EXTERNAL DATA BUS WIDTH:  16

HAS ADC:  YES

JESD-30 CODE:  S-PQFP-G100

JESD-609 CODE:  E2

LENGTH:  14 MM

MANUFACTURER:  RENESAS ELECTRONICS CORPORATION

MANUFACTURER PART NUMBER:  M30245FCGP

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF I/O LINES:  83

NUMBER OF TERMINALS:  100

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -20 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP100,.63SQ,20

PACKAGE EQUIVALENCE CODE:  QFP100,.63SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  100

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  10240

ROM (WORDS):  131072

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  1.7 MM

SPEED:  16 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  43 MA

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN COPPER

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER

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