R1LP0408CSB-5SC#S0
0.400 INCH, LEAD FREE, PLASTIC, TSOP2-32Call for availability
Mfr Part#: R1LP0408CSB-5SC#S0
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP2
PACKAGE DESCRIPTION: 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PART PACKAGE CODE: TSOP2
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 55 NS
JESD-30 CODE: R-PDSO-G32
LENGTH: 20.95 MM
MANUFACTURER: RENESAS ELECTRONICS CORPORATION
MANUFACTURER PART NUMBER: R1LP0408CSB-5SC#S0
MEMORY DENSITY: 4.1943 MBIT
MEMORY IC TYPE: STANDARD SRAM
MEMORY WIDTH: 8
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 32
NUMBER OF WORDS: 524.288 K
NUMBER OF WORDS CODE: 512000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: -20 °C
ORGANIZATION: 512KX8
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP2
PACKAGE DESCRIPTION: 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: TSOP2
PIN COUNT: 32
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.2 MM
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 4.5 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: OTHER
TERMINAL FORM: GULL WING
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: DUAL
WIDTH: 10.16 MM
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