UPD30500S2-200

UPD30500S2-200

Call for availability

Manufactured by:

RENESAS

Mfr Part#:  UPD30500S2-200

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  64

BIT SIZE:  64

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  100 MHZ

EXTERNAL DATA BUS WIDTH:  64

FORMAT:  FLOATING POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B272

LOW POWER MODE:  YES

MANUFACTURER:  RENESAS ELECTRONICS CORPORATION

MANUFACTURER PART NUMBER:  UPD30500S2-200

NUMBER OF TERMINALS:  272

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PIN COUNT:  272

QUALIFICATION STATUS:  NOT QUALIFIED

SPEED:  200 MHZ

SUPPLY VOLTAGE-MAX:  3.465 V

SUPPLY VOLTAGE-MIN:  3.135 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  MOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL POSITION:  BOTTOM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC

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