UPD70F3233M2GK(A)-9EU-A
QFP, TQFP80,.55SQCall for availability
Manufactured by:
Mfr Part#: UPD70F3233M2GK(A)-9EU-A
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, TQFP80,.55SQ
PACKAGE EQUIVALENCE CODE: TQFP80,.55SQ
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BIT SIZE: 32
CPU FAMILY: V850
JESD-30 CODE: S-PQFP-G80
MANUFACTURER: RENESAS ELECTRONICS CORPORATION
MANUFACTURER PART NUMBER: UPD70F3233M2GK(A)-9EU-A
NUMBER OF TERMINALS: 80
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, TQFP80,.55SQ
PACKAGE EQUIVALENCE CODE: TQFP80,.55SQ
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
POWER SUPPLIES: 3.5/5.5 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 12288
ROM (WORDS): 262144
ROM PROGRAMMABILITY: FLASH
SCREENING LEVEL: AEC-Q100
SPEED: 20 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY CURRENT-MAX: 40 MA
SURFACE MOUNT: YES
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
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