UPD78F0855MAA2-FAA-G
SSOP, SSOP16,.25Call for availability
Manufactured by:
Mfr Part#: UPD78F0855MAA2-FAA-G
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SSOP
PACKAGE DESCRIPTION: SSOP, SSOP16,.25
PACKAGE EQUIVALENCE CODE: SSOP16,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, SHRINK PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BIT SIZE: 8
CPU FAMILY: UPD78K0
JESD-30 CODE: R-PDSO-G16
MANUFACTURER: RENESAS ELECTRONICS CORPORATION
MANUFACTURER PART NUMBER: UPD78F0855MAA2-FAA-G
NUMBER OF TERMINALS: 16
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SSOP
PACKAGE DESCRIPTION: SSOP, SSOP16,.25
PACKAGE EQUIVALENCE CODE: SSOP16,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, SHRINK PITCH
POWER SUPPLIES: 2/5 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 512
ROM (WORDS): 8192
ROM PROGRAMMABILITY: FLASH
SCREENING LEVEL: AEC-Q100
SPEED: 20 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY CURRENT-MAX: 9.2 MA
SURFACE MOUNT: YES
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FORM: GULL WING
TERMINAL PITCH: 635 ΜM
TERMINAL POSITION: DUAL
UPS/UCS/PERIPHERAL ICS TYPE: MICROCONTROLLER
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