BH6629BFS-E2
SSOP, SOP24,.3,32Call for availability
Mfr Part#: BH6629BFS-E2
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SSOP
PACKAGE DESCRIPTION: SSOP, SOP24,.3,32
PACKAGE EQUIVALENCE CODE: SOP24,.3,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, SHRINK PITCH
PART PACKAGE CODE: SSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
DRIVE TYPE: FLOPPY
INTERFACE IC TYPE: READ WRITE AMPLIFIER CIRCUIT
JESD-30 CODE: R-PDSO-G24
JESD-609 CODE: E3/E2
LENGTH: 10 MM
MANUFACTURER: ROHM SEMICONDUCTOR
MANUFACTURER PART NUMBER: BH6629BFS-E2
NUMBER OF CHANNELS: 2
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 24
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SSOP
PACKAGE DESCRIPTION: SSOP, SOP24,.3,32
PACKAGE EQUIVALENCE CODE: SOP24,.3,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, SHRINK PITCH
PART PACKAGE CODE: SSOP
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 24
POWER SUPPLIES: 5 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.9 MM
SUBCATEGORY: DRIVE ELECTRONICS
SUPPLY CURRENT-MAX: 40 MA
SUPPLY VOLTAGE-MAX: 5.5 V
SUPPLY VOLTAGE-MIN: 4.5 V
SUPPLY VOLTAGE-NOM: 5 V
SURFACE MOUNT: YES
TECHNOLOGY: BICMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/TIN COPPER
TERMINAL FORM: GULL WING
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 10
WIDTH: 5.4 MM
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