BR24C01AF-E2

BR24C01AF-E2

LSOP

Call for availability

Manufactured by:

ROHM SEMICONDUCTOR

Mfr Part#:  BR24C01AF-E2

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSOP

PACKAGE DESCRIPTION:  LSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  HARDWARE AND SOFTWARE WRITE PROTECTION; 2 WIRE SERIAL INTERFACE; 10 YEARS DATA RETENTION

CLOCK FREQUENCY-MAX (FCLK):  100 KHZ

JESD-30 CODE:  R-PDSO-G8

LENGTH:  5 MM

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  BR24C01AF-E2

MEMORY DENSITY:  1.024 KBIT

MEMORY IC TYPE:  EEPROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  128 WORDS

NUMBER OF WORDS CODE:  128

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  128X8

OUTPUT CHARACTERISTICS:  OPEN-DRAIN

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSOP

PACKAGE DESCRIPTION:  LSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  SOIC

PIN COUNT:  8

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

SERIAL BUS TYPE:  I2C

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

WIDTH:  4.4 MM

WRITE CYCLE TIME-MAX (TWC):  25 MS

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