BR24C01AFV-W

BR24C01AFV-W

LSSOP, TSSOP8,.25

Call for availability

Manufactured by:

ROHM SEMICONDUCTOR

Mfr Part#:  BR24C01AFV-W

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSSOP

PACKAGE DESCRIPTION:  LSSOP, TSSOP8,.25

PACKAGE EQUIVALENCE CODE:  TSSOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CLOCK FREQUENCY-MAX (FCLK):  400 KHZ

DATA RETENTION TIME-MIN:  10

ENDURANCE:  100000 WRITE/ERASE CYCLES

I2C CONTROL BYTE:  1010DDDR

JESD-30 CODE:  R-PDSO-G8

JESD-609 CODE:  E2

LENGTH:  4.4 MM

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  BR24C01AFV-W

MEMORY DENSITY:  1.024 KBIT

MEMORY IC TYPE:  EEPROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  128 WORDS

NUMBER OF WORDS CODE:  128

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  128X8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSSOP

PACKAGE DESCRIPTION:  LSSOP, TSSOP8,.25

PACKAGE EQUIVALENCE CODE:  TSSOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  SOIC

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  8

POWER SUPPLIES:  3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.25 MM

SERIAL BUS TYPE:  I2C

STANDBY CURRENT-MAX:  2 ΜA

SUBCATEGORY:  EEPROMS

SUPPLY CURRENT-MAX:  2 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/COPPER (SN/CU)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  10

WIDTH:  3 MM

WRITE PROTECTION:  HARDWARE

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