BR93LC56RF-W
LSOP, SOP8,.25Call for availability
Mfr Part#: BR93LC56RF-W
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LSOP
PACKAGE DESCRIPTION: LSOP, SOP8,.25
PACKAGE EQUIVALENCE CODE: SOP8,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, LOW PROFILE
PART PACKAGE CODE: SOIC
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CLOCK FREQUENCY-MAX (FCLK): 1 MHZ
DATA RETENTION TIME-MIN: 10
ENDURANCE: 100000 WRITE/ERASE CYCLES
JESD-30 CODE: R-PDSO-G8
JESD-609 CODE: E2
LENGTH: 5 MM
MANUFACTURER: ROHM SEMICONDUCTOR
MANUFACTURER PART NUMBER: BR93LC56RF-W
MEMORY DENSITY: 2.048 KBIT
MEMORY IC TYPE: EEPROM
MEMORY WIDTH: 16
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 8
NUMBER OF WORDS: 128 WORDS
NUMBER OF WORDS CODE: 128
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 128X16
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LSOP
PACKAGE DESCRIPTION: LSOP, SOP8,.25
PACKAGE EQUIVALENCE CODE: SOP8,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, LOW PROFILE
PARALLEL/SERIAL: SERIAL
PART PACKAGE CODE: SOIC
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 8
POWER SUPPLIES: 2/5.5 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.6 MM
SERIAL BUS TYPE: MICROWIRE
STANDBY CURRENT-MAX: 3 ΜA
SUBCATEGORY: EEPROMS
SUPPLY CURRENT-MAX: 3 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 2.7 V
SUPPLY VOLTAGE-NOM (VSUP): 3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN COPPER
TERMINAL FORM: GULL WING
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 10
WIDTH: 4.4 MM
WRITE CYCLE TIME-MAX (TWC): 25 MS
WRITE PROTECTION: SOFTWARE
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