BU2286FV-E2
TSSOP, TSSOP16,.25Call for availability
Mfr Part#: BU2286FV-E2
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP16,.25
PACKAGE EQUIVALENCE CODE: TSSOP16,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: R-PDSO-G16
MANUFACTURER: ROHM SEMICONDUCTOR
MANUFACTURER PART NUMBER: BU2286FV-E2
NUMBER OF TERMINALS: 16
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: -10 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP16,.25
PACKAGE EQUIVALENCE CODE: TSSOP16,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: CLOCK GENERATORS
SUPPLY CURRENT-MAX: 50 MA
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 635 ΜM
TERMINAL POSITION: DUAL
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