BU2286FV-E2

BU2286FV-E2

TSSOP, TSSOP16,.25

Call for availability

Manufactured by:

ROHM SEMICONDUCTOR

Mfr Part#:  BU2286FV-E2

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP16,.25

PACKAGE EQUIVALENCE CODE:  TSSOP16,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDSO-G16

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  BU2286FV-E2

NUMBER OF TERMINALS:  16

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  -10 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP16,.25

PACKAGE EQUIVALENCE CODE:  TSSOP16,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  CLOCK GENERATORS

SUPPLY CURRENT-MAX:  50 MA

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  635 ΜM

TERMINAL POSITION:  DUAL

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