BU2302F

BU2302F

LSOP, SOP8,.25

Call for availability

Manufactured by:

ROHM SEMICONDUCTOR

Mfr Part#:  BU2302F

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSOP

PACKAGE DESCRIPTION:  LSOP, SOP8,.25

PACKAGE EQUIVALENCE CODE:  SOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  OSCILLATION FREQUENCY CAN BE SET FREELY USING EXTERNAL CR

ANALOG IC - OTHER TYPE:  PULSE

JESD-30 CODE:  R-PDSO-G8

LENGTH:  5 MM

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  BU2302F

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

OPERATING TEMPERATURE-MAX:  75 °C

OPERATING TEMPERATURE-MIN:  -20 °C

OUTPUT FREQUENCY-MAX:  1.17 GHZ

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSOP

PACKAGE DESCRIPTION:  LSOP, SOP8,.25

PACKAGE EQUIVALENCE CODE:  SOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE

PART PACKAGE CODE:  SOIC

PIN COUNT:  8

POWER SUPPLIES:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

SUBCATEGORY:  ANALOG WAVEFORM GENERATION FUNCTIONS

SUPPLY VOLTAGE-MAX (VSUP):  6 V

SUPPLY VOLTAGE-MIN (VSUP):  1.8 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL EXTENDED

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

WIDTH:  4.4 MM

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