BU8244F-E2

BU8244F-E2

LSOP

Call for availability

Manufactured by:

ROHM SEMICONDUCTOR

Mfr Part#:  BU8244F-E2

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSOP

PACKAGE DESCRIPTION:  LSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDSO-G16

JESD-609 CODE:  E3/E2

LENGTH:  10 MM

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  BU8244F-E2

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  16

OPERATING TEMPERATURE-MAX:  75 °C

OPERATING TEMPERATURE-MIN:  -25 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSOP

PACKAGE DESCRIPTION:  LSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE

PART PACKAGE CODE:  SOIC

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  16

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TELECOM IC TYPE:  SUPPORT CIRCUIT

TEMPERATURE GRADE:  COMMERCIAL EXTENDED

TERMINAL FINISH:  TIN/TIN COPPER

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  10

WIDTH:  4.4 MM

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