MCR01MZSF1004
Res Thick Film 0402 1M Ohm 1% 1/16W ±250ppm/°C Molded SMD Paper T/R, Surface MountCall for availability
Manufactured by:
Mfr Part#: MCR01MZSF1004
PACKAGE DESCRIPTION: SMT, 0402
PACKAGE HEIGHT: 350 ΜM
PACKAGE LENGTH: 1 MM
PACKAGE SHAPE: RECTANGULAR PACKAGE
PACKAGE STYLE: SMT
PACKAGE WIDTH: 500 ΜM
PACKING METHOD: TR, PAPER
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CONSTRUCTION: CHIP
JESD-609 CODE: E3
MANUFACTURER: ROHM SEMICONDUCTOR
MANUFACTURER PART NUMBER: MCR01MZSF1004
MANUFACTURER SERIES: MCR
MOUNTING FEATURE: SURFACE MOUNT
NUMBER OF TERMINALS: 2
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -55 °C
PACKAGE DESCRIPTION: SMT, 0402
PACKAGE HEIGHT: 350 ΜM
PACKAGE LENGTH: 1 MM
PACKAGE SHAPE: RECTANGULAR PACKAGE
PACKAGE STYLE: SMT
PACKAGE WIDTH: 500 ΜM
PACKING METHOD: TR, PAPER
RATED POWER DISSIPATION (P): 63 MW
RATED TEMPERATURE: 70 °C
RESISTANCE: 1 MO
RESISTOR TYPE: FIXED RESISTOR
SERIES: MCR01MZS(F TOL)
SIZE CODE: 0402
SUBCATEGORY: FIXED RESISTORS
SURFACE MOUNT: YES
TECHNOLOGY: METAL GLAZE/THICK FILM
TEMPERATURE COEFFICIENT: 200 PPM/°C
TERMINAL FINISH: TIN (SN) - WITH NICKEL (NI) BARRIER
TERMINAL SHAPE: WRAPAROUND
TOLERANCE: 1 %
WORKING VOLTAGE: 50 V
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