Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CONSTRUCTION: CHIP
JESD-609 CODE: E3
MANUFACTURER: ROHM SEMICONDUCTOR
MANUFACTURER PART NUMBER: MCR03FZHF1501
MANUFACTURER SERIES: MCR03
MOUNTING FEATURE: SURFACE MOUNT
OPERATING TEMPERATURE-MAX: 155 °C
OPERATING TEMPERATURE-MIN: -55 °C
PACKAGE DESCRIPTION: SMT, 0603
PACKAGE HEIGHT: 450 ΜM
PACKAGE LENGTH: 1.6 MM
PACKAGE SHAPE: RECTANGULAR PACKAGE
PACKAGE STYLE: SMT
PACKAGE WIDTH: 800 ΜM
PACKING METHOD: TR, PAPER
RATED POWER DISSIPATION (P): 100 MW
RATED TEMPERATURE: 70 °C
RESISTANCE: 1.5 KO
RESISTOR TYPE: FIXED RESISTOR
SERIES: MCR03(F,E96,200PPM)
SIZE CODE: 0603
SUBCATEGORY: FIXED RESISTORS
SURFACE MOUNT: YES
TECHNOLOGY: METAL GLAZE/THICK FILM
TEMPERATURE COEFFICIENT: 200 PPM/°C
TERMINAL FINISH: TIN
TERMINAL SHAPE: WRAPAROUND
TOLERANCE: 1 %
WORKING VOLTAGE: 50 V
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