MCR10QZHF1000

MCR10QZHF1000

SMT, 0805

Call for availability

Manufactured by:

ROHM SEMICONDUCTOR

Mfr Part#:  MCR10QZHF1000

PACKAGE DESCRIPTION:  SMT, 0805

PACKAGE HEIGHT:  550 ΜM

PACKAGE LENGTH:  2 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  1.25 MM

PACKING METHOD:  TR, PAPER

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CONSTRUCTION:  CHIP

JESD-609 CODE:  E3

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  MCR10QZHF1000

MANUFACTURER SERIES:  MCR10

MOUNTING FEATURE:  SURFACE MOUNT

OPERATING TEMPERATURE-MAX:  155 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  SMT, 0805

PACKAGE HEIGHT:  550 ΜM

PACKAGE LENGTH:  2 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  1.25 MM

PACKING METHOD:  TR, PAPER

RATED POWER DISSIPATION (P):  125 MW

RATED TEMPERATURE:  70 °C

RESISTANCE:  100 O

RESISTOR TYPE:  FIXED RESISTOR

SERIES:  MCR10(F TOL)

SIZE CODE:  0805

SUBCATEGORY:  FIXED RESISTORS

SURFACE MOUNT:  YES

TECHNOLOGY:  METAL GLAZE/THICK FILM

TEMPERATURE COEFFICIENT:  100 PPM/°C

TERMINAL FINISH:  TIN

TERMINAL SHAPE:  WRAPAROUND

TOLERANCE:  1 %

WORKING VOLTAGE:  150 V

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