CL10B331KBNC

CL10B331KBNC

CHIP

Call for availability

Manufactured by:

SAMSUNG

Mfr Part#:  CL10B331KBNC

PACKAGE DESCRIPTION:  CHIP

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKING METHOD:  TR, CARDBOARD, 7 INCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CAPACITANCE:  330 PF

CAPACITOR TYPE:  CERAMIC CAPACITOR

DIELECTRIC MATERIAL:  CERAMIC

JESD-609 CODE:  E3

MANUFACTURER:  SAMSUNG ELECTRO-MECHANICS

MANUFACTURER PART NUMBER:  CL10B331KBNC

MANUFACTURER SERIES:  CL

MOUNTING FEATURE:  SURFACE MOUNT

MULTILAYER:  YES

NEGATIVE TOLERANCE:  10 %

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  CHIP

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKING METHOD:  TR, CARDBOARD, 7 INCH

PBFREE CODE:  YES

POSITIVE TOLERANCE:  10 %

RATED (DC) VOLTAGE (URDC):  50 V

SIZE CODE:  0603

SURFACE MOUNT:  YES

TEMPERATURE CHARACTERISTICS CODE:  X7R

TEMPERATURE COEFFICIENT:  15% PPM/°C

TERMINAL FINISH:  TIN OVER NICKEL

TERMINAL SHAPE:  WRAPAROUND

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*