ACCESS MODE:  FOUR BANK PAGE BURST

ACCESS TIME-MAX:  700 PS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

CLOCK FREQUENCY-MAX (FCLK):  222 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  2,4,8

JESD-30 CODE:  S-PBGA-B144

JESD-609 CODE:  E0

LENGTH:  12 MM

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  K4D623238B-GC45

MEMORY DENSITY:  67.1089 MBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  32

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  144

NUMBER OF WORDS:  2.0972 M

NUMBER OF WORDS CODE:  2000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  65 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  2MX32

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA, BGA144,12X12,32

PACKAGE EQUIVALENCE CODE:  BGA144,12X12,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  144

POWER SUPPLIES:  2.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.4 MM

SEQUENTIAL BURST LENGTH:  2,4,8,FP

STANDBY CURRENT-MAX:  65 MA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  800 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  2.625 V

SUPPLY VOLTAGE-MIN (VSUP):  2.375 V

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  12 MM