ACCESS MODE:  FAST PAGE WITH EDO

ACCESS TIME-MAX:  50 NS

ADDITIONAL FEATURE:  RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

I/O TYPE:  COMMON

JESD-30 CODE:  R-PDSO-G50

JESD-609 CODE:  E0

LENGTH:  20.95 MM

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  K4E641612D-TC50

MEMORY DENSITY:  67.1089 MBIT

MEMORY IC TYPE:  EDO DRAM

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  50

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  4MX16

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP2

PACKAGE DESCRIPTION:  TSOP2, TSOP50,.46,32

PACKAGE EQUIVALENCE CODE:  TSOP50,.46,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PART PACKAGE CODE:  TSOP2

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  50

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  4096

SEATED HEIGHT-MAX:  1.2 MM

SELF REFRESH:  NO

STANDBY CURRENT-MAX:  500 ΜA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  120 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  10.16 MM