ACCESS MODE:  FAST PAGE

ACCESS TIME-MAX:  60 NS

ADDITIONAL FEATURE:  RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

I/O TYPE:  COMMON

JESD-30 CODE:  R-PDSO-G24

JESD-609 CODE:  E0

LENGTH:  17.14 MM

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  K4F170411D-FC60

MEMORY DENSITY:  16.7772 MBIT

MEMORY IC TYPE:  FAST PAGE DRAM

MEMORY WIDTH:  4

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  24

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  4MX4

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP2

PACKAGE DESCRIPTION:  TSOP2, TSOP24/26,.36

PACKAGE EQUIVALENCE CODE:  TSOP24/26,.36

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PART PACKAGE CODE:  TSOP2

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  26

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  4096

SEATED HEIGHT-MAX:  1.2 MM

SELF REFRESH:  NO

STANDBY CURRENT-MAX:  1 MA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  100 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  7.62 MM