K7B401825B-QC75
LQFP, QFP100,.63X.87Call for availability
Mfr Part#: K7B401825B-QC75
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LQFP
PACKAGE DESCRIPTION: LQFP, QFP100,.63X.87
PACKAGE EQUIVALENCE CODE: QFP100,.63X.87
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: FLATPACK, LOW PROFILE
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 7.5 NS
CLOCK FREQUENCY-MAX (FCLK): 117 MHZ
I/O TYPE: COMMON
JESD-30 CODE: R-PQFP-G100
JESD-609 CODE: E0
LENGTH: 20 MM
MANUFACTURER: SAMSUNG SEMICONDUCTOR
MANUFACTURER PART NUMBER: K7B401825B-QC75
MEMORY DENSITY: 4.7186 MBIT
MEMORY IC TYPE: CACHE SRAM
MEMORY WIDTH: 18
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 100
NUMBER OF WORDS: 262.144 K
NUMBER OF WORDS CODE: 256000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 256KX18
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LQFP
PACKAGE DESCRIPTION: LQFP, QFP100,.63X.87
PACKAGE EQUIVALENCE CODE: QFP100,.63X.87
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: FLATPACK, LOW PROFILE
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: QFP
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 100
POWER SUPPLIES: 2.5/3.3,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.6 MM
STANDBY CURRENT-MAX: 50 MA
STANDBY VOLTAGE-MIN: 3.14 V
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 7.5 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 3.135 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 14 MM
Related Products
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