ACCESS TIME-MAX:  2.5 NS

ADDITIONAL FEATURE:  PIPELINED ARCHITECTURE

CLOCK FREQUENCY-MAX (FCLK):  166 MHZ

I/O TYPE:  SEPARATE

JESD-30 CODE:  R-PBGA-B165

JESD-609 CODE:  E0

LENGTH:  15 MM

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  K7Q161854A-FC16

MEMORY DENSITY:  18.8744 MBIT

MEMORY IC TYPE:  QDR SRAM

MEMORY WIDTH:  18

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  165

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  1MX18

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA, BGA165,11X15,40

PACKAGE EQUIVALENCE CODE:  BGA165,11X15,40

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  165

POWER SUPPLIES:  1.5/1.8,2.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.4 MM

STANDBY CURRENT-MAX:  190 MA

STANDBY VOLTAGE-MIN:  2.4 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  460 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  2.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.4 V

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  13 MM