ACCESS TIME-MAX:  70 NS

ALTERNATE MEMORY WIDTH:  8

BOOT BLOCK:  BOTTOM

COMMAND USER INTERFACE:  YES

COMMON FLASH INTERFACE:  YES

DATA POLLING:  YES

JESD-30 CODE:  R-PBGA-B48

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  K8D6316UBM-DI07

MEMORY DENSITY:  67.1089 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  16

NUMBER OF SECTORS/SIZE:  8,127

NUMBER OF TERMINALS:  48

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  4MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FBGA

PACKAGE DESCRIPTION:  FBGA, BGA48,6X8,32

PACKAGE EQUIVALENCE CODE:  BGA48,6X8,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  2.7 V

QUALIFICATION STATUS:  NOT QUALIFIED

READY/BUSY:  YES

SECTOR SIZE:  8K,64K

STANDBY CURRENT-MAX:  30 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  50 ΜA

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TOGGLE BIT:  YES

TYPE:  NOR TYPE