KM416V256DT-6
0.400 INCH, TSOP2-44/40Call for availability
Mfr Part#: KM416V256DT-6
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP2
PACKAGE DESCRIPTION: 0.400 INCH, TSOP2-44/40
PACKAGE EQUIVALENCE CODE: TSOP40/44,.46,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PART PACKAGE CODE: TSOP2
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS MODE: FAST PAGE
ACCESS TIME-MAX: 60 NS
ADDITIONAL FEATURE: RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O TYPE: COMMON
JESD-30 CODE: R-PDSO-G40
JESD-609 CODE: E0
LENGTH: 18.41 MM
MANUFACTURER: SAMSUNG SEMICONDUCTOR
MANUFACTURER PART NUMBER: KM416V256DT-6
MEMORY DENSITY: 4.1943 MBIT
MEMORY IC TYPE: FAST PAGE DRAM
MEMORY WIDTH: 16
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 1
NUMBER OF TERMINALS: 40
NUMBER OF WORDS: 262.144 K
NUMBER OF WORDS CODE: 256000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 256KX16
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP2
PACKAGE DESCRIPTION: 0.400 INCH, TSOP2-44/40
PACKAGE EQUIVALENCE CODE: TSOP40/44,.46,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PART PACKAGE CODE: TSOP2
PIN COUNT: 44
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
REFRESH CYCLES: 512
SEATED HEIGHT-MAX: 1.2 MM
SELF REFRESH: NO
STANDBY CURRENT-MAX: 500 ΜA
SUBCATEGORY: DRAMS
SUPPLY CURRENT-MAX: 90 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 3 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: DUAL
WIDTH: 10.16 MM
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