ACCESS MODE:  SINGLE BANK PAGE BURST

ACCESS TIME-MAX:  400 PS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

CLOCK FREQUENCY-MAX (FCLK):  400 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-XDMA-N200

LENGTH:  67.6 MM

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  M470T2863FB3-CF7

MEMORY DENSITY:  8.5899 GBIT

MEMORY IC TYPE:  DDR DRAM MODULE

MEMORY WIDTH:  64

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  200

NUMBER OF WORDS:  134.2177 M

NUMBER OF WORDS CODE:  128000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  128MX64

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  UNSPECIFIED

PACKAGE CODE:  DIMM

PACKAGE DESCRIPTION:  DIMM, DIMM200,24

PACKAGE EQUIVALENCE CODE:  DIMM200,24

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  MICROELECTRONIC ASSEMBLY

PART PACKAGE CODE:  MODULE

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  200

POWER SUPPLIES:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  8192

SEATED HEIGHT-MAX:  30.15 MM

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  1.28 MA

SUPPLY VOLTAGE-MAX (VSUP):  1.9 V

SUPPLY VOLTAGE-MIN (VSUP):  1.7 V

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  600 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED