RC2012F913CS
SMT, 0805Call for availability
Manufactured by:
Mfr Part#: RC2012F913CS
PACKAGE DESCRIPTION: SMT, 0805
PACKAGE HEIGHT: 500 ΜM
PACKAGE LENGTH: 2 MM
PACKAGE SHAPE: RECTANGULAR PACKAGE
PACKAGE STYLE: SMT
PACKAGE WIDTH: 1.25 MM
PACKING METHOD: TR, 7 INCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CONSTRUCTION: CHIP
JESD-609 CODE: E3
MANUFACTURER: SAMSUNG ELECTRO-MECHANICS
MANUFACTURER PART NUMBER: RC2012F913CS
MOUNTING FEATURE: SURFACE MOUNT
NUMBER OF TERMINALS: 2
OPERATING TEMPERATURE-MAX: 155 °C
OPERATING TEMPERATURE-MIN: -55 °C
PACKAGE DESCRIPTION: SMT, 0805
PACKAGE HEIGHT: 500 ΜM
PACKAGE LENGTH: 2 MM
PACKAGE SHAPE: RECTANGULAR PACKAGE
PACKAGE STYLE: SMT
PACKAGE WIDTH: 1.25 MM
PACKING METHOD: TR, 7 INCH
PBFREE CODE: YES
RATED POWER DISSIPATION (P): 125 MW
RESISTANCE: 91 KO
RESISTOR TYPE: FIXED RESISTOR
SIZE CODE: 0805
SUBCATEGORY: FIXED RESISTOR
SURFACE MOUNT: YES
TECHNOLOGY: METAL GLAZE/THICK FILM
TEMPERATURE COEFFICIENT: 100 PPM/°C
TERMINAL FINISH: MATTE TIN (SN) - WITH NICKEL (NI) BARRIER
TOLERANCE: 1 %
WORKING VOLTAGE: 150 V
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