S3C44B0X01-ED80
QFP, QFP160,1.0SQ,20Call for availability
Manufactured by:
Mfr Part#: S3C44B0X01-ED80
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, QFP160,1.0SQ,20
PACKAGE EQUIVALENCE CODE: QFP160,1.0SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BIT SIZE: 32
JESD-30 CODE: S-PQFP-G160
MANUFACTURER: SAMSUNG SEMICONDUCTOR
MANUFACTURER PART NUMBER: S3C44B0X01-ED80
NUMBER OF TERMINALS: 160
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, QFP160,1.0SQ,20
PACKAGE EQUIVALENCE CODE: QFP160,1.0SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
POWER SUPPLIES: 2.5,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SPEED: 66 MHZ
SUBCATEGORY: MICROPROCESSORS
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC
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