S3C4510B01-QER0

S3C4510B01-QER0

QFP, QFP208,1.2SQ,20

Call for availability

Manufactured by:

SAMSUNG

Mfr Part#:  S3C4510B01-QER0

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP208,1.2SQ,20

PACKAGE EQUIVALENCE CODE:  QFP208,1.2SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PQFP-G208

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  S3C4510B01-QER0

NUMBER OF TERMINALS:  208

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP208,1.2SQ,20

PACKAGE EQUIVALENCE CODE:  QFP208,1.2SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  OTHER MICROPROCESSOR ICS

SUPPLY CURRENT-MAX:  230 MA

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

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