S3P8245XZZ-TW85

S3P8245XZZ-TW85

QFP, TQFP80,.55SQ

Call for availability

Manufactured by:

SAMSUNG

Mfr Part#:  S3P8245XZZ-TW85

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, TQFP80,.55SQ

PACKAGE EQUIVALENCE CODE:  TQFP80,.55SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BIT SIZE:  8

CPU FAMILY:  SAM8

JESD-30 CODE:  S-PQFP-G80

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  S3P8245XZZ-TW85

NUMBER OF TERMINALS:  80

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, TQFP80,.55SQ

PACKAGE EQUIVALENCE CODE:  TQFP80,.55SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

POWER SUPPLIES:  2/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  528

ROM (WORDS):  16384

ROM PROGRAMMABILITY:  UVPROM

SPEED:  10 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  25 MA

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

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