SDIN8DE2-4G-XI
PACKAGECall for availability
Manufactured by:
Mfr Part#: SDIN8DE2-4G-XI
PACKAGE BODY MATERIAL: UNSPECIFIED
PACKAGE CODE: DIE
PACKAGE DESCRIPTION: PACKAGE
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: UNCASED CHIP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
HOST DATA TRANSFER RATE-MAX: 120 MBPS
JESD-30 CODE: R-XUUC-N
MANUFACTURER: SANDISK CORPORATION
MANUFACTURER PART NUMBER: SDIN8DE2-4G-XI
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: UNSPECIFIED
PACKAGE CODE: DIE
PACKAGE DESCRIPTION: PACKAGE
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: UNCASED CHIP
SUPPLY VOLTAGE-MAX: 3.6 V
SUPPLY VOLTAGE-MIN: 2.7 V
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: NO LEAD
TERMINAL POSITION: UPPER
UPS/UCS/PERIPHERAL ICS TYPE: SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
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