SDSDQAD-064G
DIECall for availability
Manufactured by:
Mfr Part#: SDSDQAD-064G
PACKAGE BODY MATERIAL: UNSPECIFIED
PACKAGE CODE: DIE
PACKAGE DESCRIPTION: DIE,
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: UNCASED CHIP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
HOST DATA TRANSFER RATE-MAX: 80 MBPS
JESD-30 CODE: R-XUUC-N
MANUFACTURER: SANDISK CORPORATION
MANUFACTURER PART NUMBER: SDSDQAD-064G
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -25 °C
PACKAGE BODY MATERIAL: UNSPECIFIED
PACKAGE CODE: DIE
PACKAGE DESCRIPTION: DIE,
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: UNCASED CHIP
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: OTHER
TERMINAL FORM: NO LEAD
TERMINAL POSITION: UPPER
UPS/UCS/PERIPHERAL ICS TYPE: SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
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