FM24C02B-DN-T-G

FM24C02B-DN-T-G

SON, SOLCC8,.11,20

Call for availability

Manufactured by:

SHANGHAI FUDAN MICROELECTRONICS

Mfr Part#:  FM24C02B-DN-T-G

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SON

PACKAGE DESCRIPTION:  SON, SOLCC8,.11,20

PACKAGE EQUIVALENCE CODE:  SOLCC8,.11,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

DATA RETENTION TIME-MIN:  100

ENDURANCE:  1000000 WRITE/ERASE CYCLES

I2C CONTROL BYTE:  1010DDDR

JESD-30 CODE:  R-PDSO-N8

MANUFACTURER:  SHANGHAI FUDAN MICROELECTRONICS GROUP CO LIMITED

MANUFACTURER PART NUMBER:  FM24C02B-DN-T-G

MEMORY DENSITY:  2.048 KBIT

MEMORY IC TYPE:  EEPROM

MEMORY WIDTH:  8

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  256 WORDS

NUMBER OF WORDS CODE:  256

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  256X8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SON

PACKAGE DESCRIPTION:  SON, SOLCC8,.11,20

PACKAGE EQUIVALENCE CODE:  SOLCC8,.11,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PARALLEL/SERIAL:  SERIAL

POWER SUPPLIES:  1.8/3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SERIAL BUS TYPE:  I2C

STANDBY CURRENT-MAX:  1 ΜA

SUBCATEGORY:  EEPROMS

SUPPLY CURRENT-MAX:  3 ΜA

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

WRITE PROTECTION:  HARDWARE

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