FM24C256A-TS-T-G
TSSOP, TSSOP8,.25Call for availability
Mfr Part#: FM24C256A-TS-T-G
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP8,.25
PACKAGE EQUIVALENCE CODE: TSSOP8,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
DATA RETENTION TIME-MIN: 40
ENDURANCE: 1000000 WRITE/ERASE CYCLES
I2C CONTROL BYTE: 1010DDDR
JESD-30 CODE: R-PDSO-G8
MANUFACTURER: SHANGHAI FUDAN MICROELECTRONICS GROUP CO LIMITED
MANUFACTURER PART NUMBER: FM24C256A-TS-T-G
MEMORY DENSITY: 262.144 KBIT
MEMORY IC TYPE: EEPROM
MEMORY WIDTH: 8
NUMBER OF TERMINALS: 8
NUMBER OF WORDS: 32.768 K
NUMBER OF WORDS CODE: 32000
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 32KX8
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP8,.25
PACKAGE EQUIVALENCE CODE: TSSOP8,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PARALLEL/SERIAL: SERIAL
POWER SUPPLIES: 1.8/5 V
QUALIFICATION STATUS: NOT QUALIFIED
SERIAL BUS TYPE: I2C
STANDBY CURRENT-MAX: 1 ΜA
SUBCATEGORY: EEPROMS
SUPPLY CURRENT-MAX: 3 ΜA
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 635 ΜM
TERMINAL POSITION: DUAL
WRITE PROTECTION: HARDWARE
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