LH28F800BGHB-TTL90

LH28F800BGHB-TTL90

TFBGA

Call for availability

Manufactured by:

SHARP

Mfr Part#:  LH28F800BGHB-TTL90

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  90 NS

JESD-30 CODE:  S-PBGA-B48

LENGTH:  8 MM

MANUFACTURER:  SHARP MICROELECTRONICS OF THE AMERICAS

MANUFACTURER PART NUMBER:  LH28F800BGHB-TTL90

MEMORY DENSITY:  8.3886 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  48

NUMBER OF WORDS:  524.288 K

NUMBER OF WORDS CODE:  512000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  512KX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PIN COUNT:  48

PROGRAMMING VOLTAGE:  2.7 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  750 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  8 MM

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