LRS1382

LRS1382

LFBGA

Call for availability

Manufactured by:

SHARP

Mfr Part#:  LRS1382

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  CONTAINS 512K X 16 BITS SRAM

JESD-30 CODE:  R-PBGA-B72

LENGTH:  11 MM

MANUFACTURER:  SHARP MICROELECTRONICS OF THE AMERICAS

MANUFACTURER PART NUMBER:  LRS1382

MEMORY DENSITY:  33.5544 MBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  72

NUMBER OF WORDS:  2.0972 M

NUMBER OF WORDS CODE:  2000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -25 °C

ORGANIZATION:  2MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PIN COUNT:  72

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.4 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.3 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  8 MM

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