S-7235B2

S-7235B2

DIP

Call for availability

Manufactured by:

SII SEMICONDUCTOR

Mfr Part#:  S-7235B2

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  SELECTABLE MAKE/BREAK RATIO 1:2

JESD-30 CODE:  R-PDIP-T22

LENGTH:  27.1 MM

MAKE-BREAK RATIO:  1:1.5

MANUFACTURER:  SII SEMICONDUCTOR CORPORATION

MANUFACTURER PART NUMBER:  S-7235B2

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  22

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  -30 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PIN COUNT:  22

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.06 MM

SUPPLY CURRENT-MAX:  4 MA

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TELECOM IC TYPE:  TELEPHONE DIALER CKT

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

WIDTH:  10.16 MM

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