ACCESS TIME-MAX:  90 NS

COMMAND USER INTERFACE:  NO

DATA POLLING:  YES

JESD-30 CODE:  R-PDIP-T32

JESD-609 CODE:  E0

LENGTH:  41.91 MM

MANUFACTURER:  SILICON STORAGE TECHNOLOGY

MANUFACTURER PART NUMBER:  SST29EE010-90-4C-PH

MEMORY DENSITY:  1.0486 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  32

NUMBER OF WORDS:  131.072 K

NUMBER OF WORDS CODE:  128000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  128KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP32,.6

PACKAGE EQUIVALENCE CODE:  DIP32,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PAGE SIZE:  128 WORDS

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  32

POWER SUPPLIES:  5 V

PROGRAMMING VOLTAGE:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.08 MM

STANDBY CURRENT-MAX:  50 ΜA

SUBCATEGORY:  EEPROMS

SUPPLY CURRENT-MAX:  50 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

TOGGLE BIT:  YES

WIDTH:  15.24 MM

WRITE CYCLE TIME-MAX (TWC):  10 MS