H27U1G8F2BTR-BC
TSSOP, TSSOP48,.8,20Call for availability
Manufactured by:
Mfr Part#: H27U1G8F2BTR-BC
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP48,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP48,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 20 NS
COMMAND USER INTERFACE: YES
DATA POLLING: NO
JESD-30 CODE: R-PDSO-G48
MANUFACTURER: SK HYNIX INC
MANUFACTURER PART NUMBER: H27U1G8F2BTR-BC
MEMORY DENSITY: 1.0737 GBIT
MEMORY IC TYPE: FLASH
MEMORY WIDTH: 8
NUMBER OF SECTORS/SIZE: 1K
NUMBER OF TERMINALS: 48
NUMBER OF WORDS: 134.2177 M
NUMBER OF WORDS CODE: 128000000
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 128MX8
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP48,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP48,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PAGE SIZE: 2K WORDS
PARALLEL/SERIAL: PARALLEL
POWER SUPPLIES: 3/3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
READY/BUSY: YES
SECTOR SIZE: 128K
STANDBY CURRENT-MAX: 50 ΜA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 30 ΜA
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TOGGLE BIT: NO
TYPE: NAND TYPE
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