ACCESS MODE:  FOUR BANK PAGE BURST

ACCESS TIME-MAX:  5.4 NS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

CLOCK FREQUENCY-MAX (FCLK):  166 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  1,2,4,8

JESD-30 CODE:  R-PBGA-B90

JESD-609 CODE:  E1

LENGTH:  13 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  H55S1222EFP-60M

MEMORY DENSITY:  134.2177 MBIT

MEMORY IC TYPE:  STATIC COLUMN DRAM

MEMORY WIDTH:  32

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  90

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -30 °C

ORGANIZATION:  4MX32

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA, BGA90,9X15,32

PACKAGE EQUIVALENCE CODE:  BGA90,9X15,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PIN COUNT:  90

POWER SUPPLIES:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  4096

SEATED HEIGHT-MAX:  1 MM

SEQUENTIAL BURST LENGTH:  1,2,4,8,FP

STANDBY CURRENT-MAX:  10 ΜA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  90 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  1.95 V

SUPPLY VOLTAGE-MIN (VSUP):  1.7 V

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN/SILVER/COPPER (SN96.5AG3.0CU0.5)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  8 MM