ACCESS MODE:  MULTI BANK PAGE BURST

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

JESD-30 CODE:  R-PBGA-B96

LENGTH:  13 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  H5AN4G6NAFR-UHC

MEMORY DENSITY:  4.295 GBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  96

NUMBER OF WORDS:  268.4355 M

NUMBER OF WORDS CODE:  256000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  256MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PEAK REFLOW TEMPERATURE (CEL):  260

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  1.26 V

SUPPLY VOLTAGE-MIN (VSUP):  1.14 V

SUPPLY VOLTAGE-NOM (VSUP):  1.2 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  7.5 MM