H5DU1262GTR-E3C
TSSOP, TSSOP66,.46Call for availability
Mfr Part#: H5DU1262GTR-E3C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP66,.46
PACKAGE EQUIVALENCE CODE: TSSOP66,.46
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 700 PS
CLOCK FREQUENCY-MAX (FCLK): 200 MHZ
I/O TYPE: COMMON
INTERLEAVED BURST LENGTH: 2,4,8
JESD-30 CODE: R-PDSO-G66
JESD-609 CODE: E6
MANUFACTURER: SK HYNIX INC
MANUFACTURER PART NUMBER: H5DU1262GTR-E3C
MEMORY DENSITY: 134.2177 MBIT
MEMORY IC TYPE: DDR DRAM
MEMORY WIDTH: 16
NUMBER OF TERMINALS: 66
NUMBER OF WORDS: 8.3886 M
NUMBER OF WORDS CODE: 8000000
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 8MX16
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP66,.46
PACKAGE EQUIVALENCE CODE: TSSOP66,.46
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
POWER SUPPLIES: 2.5 V
QUALIFICATION STATUS: NOT QUALIFIED
REFRESH CYCLES: 4096
SEQUENTIAL BURST LENGTH: 2,4,8
STANDBY CURRENT-MAX: 10 MA
SUBCATEGORY: DRAMS
SUPPLY CURRENT-MAX: 300 ΜA
SUPPLY VOLTAGE-NOM (VSUP): 2.5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/BISMUTH (SN/BI)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 635 ΜM
TERMINAL POSITION: DUAL
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