H5DU1262GTR-E3C

H5DU1262GTR-E3C

TSSOP, TSSOP66,.46

Call for availability

Manufactured by:

SK HYNIX

Mfr Part#:  H5DU1262GTR-E3C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP66,.46

PACKAGE EQUIVALENCE CODE:  TSSOP66,.46

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  700 PS

CLOCK FREQUENCY-MAX (FCLK):  200 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  2,4,8

JESD-30 CODE:  R-PDSO-G66

JESD-609 CODE:  E6

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  H5DU1262GTR-E3C

MEMORY DENSITY:  134.2177 MBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  16

NUMBER OF TERMINALS:  66

NUMBER OF WORDS:  8.3886 M

NUMBER OF WORDS CODE:  8000000

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  8MX16

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP66,.46

PACKAGE EQUIVALENCE CODE:  TSSOP66,.46

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

POWER SUPPLIES:  2.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  4096

SEQUENTIAL BURST LENGTH:  2,4,8

STANDBY CURRENT-MAX:  10 MA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  300 ΜA

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/BISMUTH (SN/BI)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  635 ΜM

TERMINAL POSITION:  DUAL

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