H5PS5182GFR-Y5C
TFBGA, BGA60,9X11,32Call for availability
Mfr Part#: H5PS5182GFR-Y5C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA60,9X11,32
PACKAGE EQUIVALENCE CODE: BGA60,9X11,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS MODE: FOUR BANK PAGE BURST
ACCESS TIME-MAX: 450 PS
ADDITIONAL FEATURE: AUTO/SELF REFRESH
CLOCK FREQUENCY-MAX (FCLK): 333 MHZ
I/O TYPE: COMMON
INTERLEAVED BURST LENGTH: 4,8
JESD-30 CODE: R-PBGA-B60
JESD-609 CODE: E1
LENGTH: 9.5 MM
MANUFACTURER: SK HYNIX INC
MANUFACTURER PART NUMBER: H5PS5182GFR-Y5C
MEMORY DENSITY: 536.8709 MBIT
MEMORY IC TYPE: DDR DRAM
MEMORY WIDTH: 8
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 1
NUMBER OF TERMINALS: 60
NUMBER OF WORDS: 67.1089 M
NUMBER OF WORDS CODE: 64000000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 95 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 64MX8
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA60,9X11,32
PACKAGE EQUIVALENCE CODE: BGA60,9X11,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 60
POWER SUPPLIES: 1.8 V
QUALIFICATION STATUS: NOT QUALIFIED
REFRESH CYCLES: 8192
SEATED HEIGHT-MAX: 1.2 MM
SEQUENTIAL BURST LENGTH: 4,8
STANDBY CURRENT-MAX: 7 MA
SUBCATEGORY: DRAMS
SUPPLY CURRENT-MAX: 110 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 1.9 V
SUPPLY VOLTAGE-MIN (VSUP): 1.7 V
SUPPLY VOLTAGE-NOM (VSUP): 1.8 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: OTHER
TERMINAL FINISH: TIN/SILVER/COPPER (SN/AG/CU)
TERMINAL FORM: BALL
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 20
WIDTH: 7.5 MM
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