ACCESS MODE:  MULTI BANK PAGE BURST

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

JESD-30 CODE:  R-PBGA-B96

LENGTH:  13 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  H5TQ2G63GFR-TEC

MEMORY DENSITY:  2.1475 GBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  96

NUMBER OF WORDS:  134.2177 M

NUMBER OF WORDS CODE:  128000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  128MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  1.575 V

SUPPLY VOLTAGE-MIN (VSUP):  1.425 V

SUPPLY VOLTAGE-NOM (VSUP):  1.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  7.5 MM