HY27US08281A-TPCB
TSOP1, TSSOP48,.8,20Call for availability
Mfr Part#: HY27US08281A-TPCB
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP1
PACKAGE DESCRIPTION: TSOP1, TSSOP48,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP48,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PART PACKAGE CODE: TSOP1
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 30 NS
COMMAND USER INTERFACE: YES
DATA POLLING: NO
JESD-30 CODE: R-PDSO-G48
JESD-609 CODE: E6
LENGTH: 18.4 MM
MANUFACTURER: SK HYNIX INC
MANUFACTURER PART NUMBER: HY27US08281A-TPCB
MEMORY DENSITY: 134.2177 MBIT
MEMORY IC TYPE: FLASH
MEMORY WIDTH: 8
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF SECTORS/SIZE: 1K
NUMBER OF TERMINALS: 48
NUMBER OF WORDS: 16.7772 M
NUMBER OF WORDS CODE: 16000000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 16MX8
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP1
PACKAGE DESCRIPTION: TSOP1, TSSOP48,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP48,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PAGE SIZE: 512 WORDS
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: TSOP1
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 48
POWER SUPPLIES: 3.3 V
PROGRAMMING VOLTAGE: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
READY/BUSY: YES
SEATED HEIGHT-MAX: 1.2 MM
SECTOR SIZE: 16K
STANDBY CURRENT-MAX: 50 ΜA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 20 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 2.7 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/BISMUTH (SN/BI)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 20
TOGGLE BIT: NO
TYPE: NAND TYPE
WIDTH: 12 MM
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