HY53C464LS-80

HY53C464LS-80

DIP, DIP18,.3

Call for availability

Manufactured by:

SK HYNIX

Mfr Part#:  HY53C464LS-80

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS MODE:  FAST PAGE

ACCESS TIME-MAX:  80 NS

ADDITIONAL FEATURE:  RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

I/O TYPE:  COMMON

JESD-30 CODE:  R-PDIP-T18

JESD-609 CODE:  E0

LENGTH:  22.987 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  HY53C464LS-80

MEMORY DENSITY:  262.144 KBIT

MEMORY IC TYPE:  FAST PAGE DRAM

MEMORY WIDTH:  4

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  18

NUMBER OF WORDS:  65.536 K

NUMBER OF WORDS CODE:  64000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  64KX4

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  18

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  256

SEATED HEIGHT-MAX:  4.699 MM

STANDBY CURRENT-MAX:  1 MA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  60 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  7.62 MM

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