HY5DU561622ETP-D43

HY5DU561622ETP-D43

TSOP2, TSSOP66,.46

Call for availability

Manufactured by:

SK HYNIX

Mfr Part#:  HY5DU561622ETP-D43

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP2

PACKAGE DESCRIPTION:  TSOP2, TSSOP66,.46

PACKAGE EQUIVALENCE CODE:  TSSOP66,.46

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PART PACKAGE CODE:  TSOP2

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS MODE:  FOUR BANK PAGE BURST

ACCESS TIME-MAX:  700 PS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

CLOCK FREQUENCY-MAX (FCLK):  200 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  2,4,8

JESD-30 CODE:  R-PDSO-G66

JESD-609 CODE:  E6

LENGTH:  22.22 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  HY5DU561622ETP-D43

MEMORY DENSITY:  268.4355 MBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  66

NUMBER OF WORDS:  16.7772 M

NUMBER OF WORDS CODE:  16000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  16MX16

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP2

PACKAGE DESCRIPTION:  TSOP2, TSSOP66,.46

PACKAGE EQUIVALENCE CODE:  TSSOP66,.46

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PART PACKAGE CODE:  TSOP2

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  66

POWER SUPPLIES:  2.6 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  8192

SEATED HEIGHT-MAX:  1.194 MM

SEQUENTIAL BURST LENGTH:  2,4,8

SUBCATEGORY:  DRAMS

SUPPLY VOLTAGE-MAX (VSUP):  2.7 V

SUPPLY VOLTAGE-MIN (VSUP):  2.4 V

SUPPLY VOLTAGE-NOM (VSUP):  2.6 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN BISMUTH

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  10.15 MM

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