HY62U8100BLLST-70I
TSOP1, TSSOP32,.56,20Call for availability
Mfr Part#: HY62U8100BLLST-70I
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP1
PACKAGE DESCRIPTION: TSOP1, TSSOP32,.56,20
PACKAGE EQUIVALENCE CODE: TSSOP32,.56,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PART PACKAGE CODE: TSOP1
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 70 NS
I/O TYPE: COMMON
JESD-30 CODE: R-PDSO-G32
JESD-609 CODE: E6
LENGTH: 11.8 MM
MANUFACTURER: SK HYNIX INC
MANUFACTURER PART NUMBER: HY62U8100BLLST-70I
MEMORY DENSITY: 1.0486 MBIT
MEMORY IC TYPE: STANDARD SRAM
MEMORY WIDTH: 8
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 32
NUMBER OF WORDS: 131.072 K
NUMBER OF WORDS CODE: 128000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 128KX8
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP1
PACKAGE DESCRIPTION: TSOP1, TSSOP32,.56,20
PACKAGE EQUIVALENCE CODE: TSSOP32,.56,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: TSOP1
PIN COUNT: 32
POWER SUPPLIES: 3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.2 MM
STANDBY VOLTAGE-MIN: 2 V
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 30 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.3 V
SUPPLY VOLTAGE-MIN (VSUP): 2.7 V
SUPPLY VOLTAGE-NOM (VSUP): 3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN BISMUTH
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
WIDTH: 8 MM
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